Thermal Pad, 2 Pack 120x20x1.5mm, 12.8 W/m.K Thermal Compound Pad, Thermal Conductivity Gap Filler, Heatsink Cooling Pad All Coolers, CPU, GPU, IC Processor, 3D Printer, Raspberry Pi
- less than 0.49 micron less than 0.000020 inch.
- Peak: –50°C to 003e180°C, Long-Term: –50°C to 130°C.
- 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core..
- A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches..